Adaptable to an enormous range of applications, the ViProbe® has been a proven buckling beam technology for more than 25 years, valued for its superior contacting quality and unique ease of repair.

Suitable for contacting:

  • Pads, solder balls
  • Gold, palladium, copper, diverse
Category Semiconductor testing products
Our solution Semicon testing and inspection
Supplier Feinmetall

Specifications of the ViProbe® at a glance:


Min pitch of the DUT Down to 56 μm
Diameter of the contact element Down to 1.6 mil
Max active area Up to 80 mm x 80 mm
Capable temperature range From -55°C to 180°C
Current carrying capability at RT Up to 800 mA
Contact force at rec. OD From 2.6 cN to 10.8 cN


Are you interested in this product or want to find out more information?


Ing. Tomáš Janků

Sales Engineer

+420 702 253 075

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