Adaptable to an enormous range of applications, the ViProbe® has been a proven buckling beam technology for more than 25 years, valued for its superior contacting quality and unique ease of repair.
Suitable for contacting:
- Pads, solder balls
- Gold, palladium, copper, diverse
|Category||Semiconductor testing products|
|Our solution||Semicon testing and inspection|
Specifications of the ViProbe® at a glance:
|Min pitch of the DUT||Down to 56 μm|
|Diameter of the contact element||Down to 1.6 mil|
|Max active area||Up to 80 mm x 80 mm|
|Capable temperature range||From -55°C to 180°C|
|Current carrying capability at RT||Up to 800 mA|
|Contact force at rec. OD||From 2.6 cN to 10.8 cN|
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