8030-2
The KY8030-2 has maintained the industry’s leading position as the best-selling True 3D Solder Paste Inspection System since entering the market. Combining Koh Young’s patented 3D dual-projection Moiré technology, it effectively eliminates critical shadow and specular reflection challenges other 3D inspection systems simply cannot address.
Target market: A very popular model thanks to its great performance/value ratio. For all customers which produce SMD/SMT.
| Category | SPI |
|---|---|
| Our solution | SMT technologies |
| Supplier | Koh Young |
Key parameters:
- Ready for in line/off line solution
- 4MPx camera
- Available with 15,20 and 25 µ lens
- Inspection speed 22.5~56.1 cm²/sec depending on lens resolution
- 2 moiré 3D shadow free projections
- Available in M, L, XL, 2XL size and Dual Lane
- Maximum PCB dimension up to 1500x690mm (2XL)
Key benefits:
- Zero-defect through AI-Powered Koh Young Process Optimizer (KPO) Printer
- Best-in-class Measurement Accuracy and Inspection Reliability
- Real-time Warp Compensation
- KSMART Solutions: True 3D Measurement-based Process Control System and connection with other SPI/ AOI Koh Young machine
FAQ:
1. What is the accuracy of SPI?
- SPI height accuracy is 1µ and the system is ready for testing of pads for SMD 01005 components.
2. Why choose SPI from Koh Young?
- Koh Young delivers accurate and parameter 3D measurement and control of paste application, early detection and prevention of faulty printing, robust statistical process control, production optimization and lower rework costs.
3. What is the impact of SPI to FPY?
- SPI can increase FPY by up to 20%.
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