Premium In-line 3D Inspection System for Micro Solder Paste Deposits.
|Category||3D measurement for semicon applications|
|Our solution||Semicon testing and inspection|
Main features and benefits of the device
- Fast and effective control (12s/FOV)
- Max height of measured objects 50 mm
- FOV size 4×4 mm
- Z height measurement range: 10 um – 3,6 mm
- Z axis resolution = 10um
- XY resolution = 7 um
- Windows 10
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