Koh Young

Meister S

Premium In-line 3D Inspection System for Micro Solder Paste Deposits.

Category 3D measurement for semicon applications
Our solution Semicon testing and inspection
Supplier Koh Young

Main features and benefits of the device

  • Fast and effective control (12s/FOV)
  • Max height of measured objects 50 mm
  • FOV size 4×4 mm
  • Z height measurement range: 10 um – 3,6 mm
  • Z axis resolution = 10um
  • XY resolution = 7 um
  • Windows 10

Are you interested in this product or want to find out more information?

Ing. Miloš Drlík

Key Account Manager

+420 727 872 614

Daniel Kotrba

Sales Engineer

+420 702 235 262

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