True 3D Measurement for High Density Substrates, Shiny Components, and Highly Reflective Components.
|Category||3D measurement for semicon applications|
|Our solution||Semicon testing and inspection|
Main features and benefits of the device
- In-line/ off-line configuration
- Resolution 5 (8) um
- 3D Shadow free moiré
- 8 projections
- 12 Mpx camera
- Z axis resolution = 1 um
- Inspection speed 300 (768) mm2/s
- Warp compensation +/- 5 mm
- Min. objects height 100 um pitch 50 um
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